THERMAL, FTIR AND EPR STUDIES OF Ni2+ AND W6+ TRANSITION METAL IONS DOPED WITH TELLURITE BARIUM BORATE GLASS AT ROOM TEMPERATURE

PALANI, R. and KUMAR, M. MARSHAL ARUN (2015) THERMAL, FTIR AND EPR STUDIES OF Ni2+ AND W6+ TRANSITION METAL IONS DOPED WITH TELLURITE BARIUM BORATE GLASS AT ROOM TEMPERATURE. Journal of Applied Physical Science International, 2 (4). pp. 145-155.

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Abstract

Glasses in the 10TeO2-15BaO-(75-x) B2O3-xNiO and 10TeO2- 15BaO-(75-x) B2O3-xWO3 (where x = 0 to 1.0 in steps of 0.2 mol %) systems were primed by using conventional melt-quenching technique. Glass formation range of the system and thermal, physical and structural features of the quaternary glasses were explored by X-ray Diffraction, Thermo Gravimetric Analysis, Differential Thermal Analysis, Electron Paramagnetic Resonance and Fourier Transform Infrared analysis according to the different molar compositions. The amorphous nature of the samples was established using X-ray diffractometry. Thermal behavior of the glasses were deliberated in terms of the glass transition (Tg), crystallization peak (Tp), melting temperatures (Tm) and the glass stability against crystallization (∆T). The electron paramagnetic resonance spectra have been traced in X-band (ν 9.78 GHz) at room temperature. The EPR study of prepared glass samples show the resonance signals at g 2.0-2.5 and g 1.97 for Ni2+ and W6+ metal ions respectively were found. Electron paramagnetic resonance data suggests the bonding between transition metal ions and ligands as a covalent/ionic in nature. Fourier transform infrared spectra of quaternary glass systems has been precise in the spectral range 400-4000 cm-1 at room temperature in order to understand the characteristic frequencies of the chemical bonds and bonding mechanisms, which are liable to the structural and spectral changes.

Item Type: Article
Subjects: Pustakas > Physics and Astronomy
Depositing User: Unnamed user with email support@pustakas.com
Date Deposited: 22 Dec 2023 13:05
Last Modified: 22 Dec 2023 13:05
URI: http://archive.pcbmb.org/id/eprint/1744

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